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PRODUCTION AND TEHNOLOGICAL POSSIBILITIES



ELECTRONIC Department



The technological process includes:

 

Modular Placement Machine



PCB exchange time
about 4.0 s
(When no components are placed on the back of the PCB)
PCB dimensions (mm) L 50 × W 50 to L 460 × W 360
High-speed head 12 nozzles
Max. speed 0.144 s/chip (Type A-2)
Placement accuracy ± 40 µm/chip (Cpk1)
Component dimensions (mm) (01005”) 0402 chip *1 to
L 12 × W 12 × T 6.5
High-flexibility head LS8 nozzles
Max. speed 0.19 s/chip(Type A-0)
Placement accuracy ± 50 µm/chip, ± 35 µm/QFP 24 mm to 50 mm,
± 50 µm/QFP<24 mm (Cpk1)
Component dimensions (mm) (0201”) 0603 chip to
L 32 × W 32 × T 8.5
Multi-functional head 3 nozzles
Max. speed 0.8 s/QFP (Type B-0)
Placement accuracy ± 35 µm/QFP (Cpk1)
Component dimensions (mm) (0201”)0603 chip to
L 100 × W 90 × T 25


Screen Printer

PCB dimensions (mm) L 50 × W 50 to L 510 × W 460
(L 330 × W 250)
Cycle time 8.0 s + printing tim
Repeatability ±12.5 μ
Screen frame dimensions L 736 × W 736
L 650 × W 550 (Horizontally oriented)
L 550 × W 650 (Vertically oriented)
L 600 × W 550 (Horizontally oriented)

 

Reflow soldering oven

Maximum Board Width Standard 20" (50.8 cm)
Top Heating Zones 7
Bottom Heating Zones 7
Number of Cooling Zones Standard 1
Temperature Range Standard 25-350° C
Heated Length 72" (183 cm)
Maximum Conveyor Speed 74"/Min
(188 cm/min.)


Cables

JQ-1- Full automatic terminal crimping machine (both ends)
NCPP-25 – Numerical cortrol precision press


MECHANICS Department – Litakovo village.

 

COATINGS Department